IC MPU 603E 266MHZ 255CBGA
| Part | Number of Cores/Bus Width | Supplier Device Package | Speed | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Package / Case | Core Processor | Graphics Acceleration | Voltage - I/O |
|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology TSPC603RVGH12LC | 1 Core, 32 Bit | 255-HiTCE-CBGA (21x21) | 266 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGS6LC | 1 Core, 32 Bit | 255-CI-CBGA (21x21) | 166 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVA8LC | 1 Core, 32 Bit | 240-CERQUAD (31x31) | 200 MHz | -40 °C | 110 °C | Surface Mount | 240-BFCQFP | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGH8LC | 1 Core, 32 Bit | 255-HiTCE-CBGA (21x21) | 200 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGS10LC | 1 Core, 32 Bit | 255-CI-CBGA (21x21) | 233 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGU12LC | 1 Core, 32 Bit | 255-CBGA (21x21) | 266 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGU10LC | 1 Core, 32 Bit | 255-CBGA (21x21) | 233 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGU8LC | 1 Core, 32 Bit | 255-CBGA (21x21) | 200 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGH10LC | 1 Core, 32 Bit | 255-HiTCE-CBGA (21x21) | 233 MHz | -40 °C | 110 °C | Surface Mount | 255-BCBGA Exposed Pad | PowerPC 603e | 3.3 V | |
Microchip Technology TSPC603RVGS12LC | 1 Core, 32 Bit | 255-CI-CGA (21x21) | 266 MHz | -40 °C | 110 °C | Surface Mount | 255-BCGA | PowerPC 603e | 3.3 V |