SOLDER PASTE THERMALLY STABLE NC
| Part | Shelf Life Start | Type | Shelf Life | Flux Type | Mesh Type | Form | Form | Composition | Melting Point [custom] | Melting Point [custom] | Mesh Type [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. TS991SNL500T3 | Date of Manufacture | Solder Paste | 12 Months | No-Clean | 3 | Jar | 17.64 oz, 500 g | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 217 °C | |
Chip Quik Inc. TS991SNL500T4 | Date of Manufacture | Solder Paste | 12 Months | No-Clean | Jar | 17.64 oz, 500 g | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 217 °C | 4 |