ESQT-137 Series
Manufacturer: Samtec Inc.
CONN SOCKET 74POS 0.079 GOLD PCB
| Part | Contact Type | Number of Positions Loaded | Row Spacing - Mating | Connector Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Style | Current Rating (Per Contact) | Fastening Type | Contact Length - Post | Insulation Color | Contact Finish - Post | Number of Rows | Material Flammability Rating | Insulation Height | Termination | Pitch - Mating | Mounting Type | Number of Positions | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish Thickness - Post | Contact Shape | Insulation Material | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 20 Ąin | Board Board or Cable | 4.5 A | Push-Pull | 0.128 in | Black | Gold | 2 | UL94 V-0 | 0.33 in | Solder | 0.079 in | Through Hole | 74 | 125 °C | -55 °C | 3 µin | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 10 µin | Board Board or Cable | 4.5 A | Push-Pull | 0.148 in | Black | Tin | 2 | UL94 V-0 | 0.31 in | Solder | 0.079 in | Through Hole | 74 | 125 °C | -55 °C | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 10 µin | Board Board or Cable | 4.5 A | Push-Pull | 0.22 in | Black | Tin | 3 | UL94 V-0 | 0.63 in | Solder | 0.079 in | Through Hole | 111 | 125 °C | -55 °C | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 20 Ąin | Board Board or Cable | 4.5 A | Push-Pull | 0.24 in | Black | Gold | 2 | UL94 V-0 | 0.61 in | Solder | 0.079 in | Through Hole | 74 | 125 °C | -55 °C | 3 µin | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 20 Ąin | Board Board or Cable | 4.5 A | Push-Pull | 0.148 in | Black | Gold | 2 | UL94 V-0 | 0.31 in | Solder | 0.079 in | Through Hole | 74 | 125 °C | -55 °C | 3 µin | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 20 Ąin | Board Board or Cable | 4.5 A | Push-Pull | 0.148 in | Black | Tin | 2 | UL94 V-0 | 0.31 in | Solder | 0.079 in | Through Hole | 74 | 125 °C | -55 °C | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 20 Ąin | Board Board or Cable | 4.5 A | Push-Pull | 0.42 in | Black | Tin | 2 | UL94 V-0 | 0.43 in | Solder | 0.079 in | Through Hole | 74 | 125 °C | -55 °C | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 20 Ąin | Board Board or Cable | 4.5 A | Push-Pull | 0.13 in | Black | Gold | 2 | UL94 V-0 | 0.72 in | Solder | 0.079 in | Through Hole | 74 | 125 °C | -55 °C | 3 µin | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
Samtec Inc. | Forked | All | 0.079 in | Elevated Socket | Gold | 20 Ąin | Board Board or Cable | 4.5 A | Push-Pull | 0.05 in | Black | Gold | 4 | UL94 V-0 | 0.408 in | Solder | 0.079 in | Through Hole | 148 | 125 °C | -55 °C | 3 µin | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze |