ESQT-137 Series

Catalog

CONN SOCKET 74POS 0.079 GOLD PCB

Part	Insulation Height	Insulation Height	Pitch - Mating [x]	Pitch - Mating [x]	Contact Material	Contact Finish - Post	Current Rating (Amps)	Mounting Type	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Termination	Connector Type	Insulation Color	Contact Shape	Insulation Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Style	Fastening Type	Number of Positions	Row Spacing - Mating	Row Spacing - Mating	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Contact Length - Post	Contact Length - Post	Material Flammability Rating	Contact Type	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. ESQT-137-03-G-D-330	8.38 mm	0.33 in	0.079 in	2 mm	Phosphor Bronze	Gold	4.5 A	Through Hole	All	3 µin	0.076 µm	Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.51 µm	20 µin	Board to Board Cable	Push-Pull	74	0.079 in	2 mm	2	-55 °C	125 °C	0.128 "	3.25 mm	UL94 V-0	Forked
Samtec Inc. ESQT-137-03-L-D-310	7.87 mm	0.31 in	0.079 in	2 mm	Phosphor Bronze	Tin	4.5 A	Through Hole	All			Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.25 çm	10 çin	Board to Board Cable	Push-Pull	74	0.079 in	2 mm	2	-55 °C	125 °C	0.148 in	3.76 mm	UL94 V-0	Forked
Samtec Inc. ESQT-137-02-L-T-630	16 mm	0.63 in	0.079 in	2 mm	Phosphor Bronze	Tin	4.5 A	Through Hole	All			Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.25 çm	10 çin	Board to Board Cable	Push-Pull	111	0.079 in	2 mm	3	-55 °C	125 °C	0.22 in	5.58 mm	UL94 V-0	Forked
Samtec Inc. ESQT-137-02-G-D-610	15.49 mm	0.61 in	0.079 in	2 mm	Phosphor Bronze	Gold	4.5 A	Through Hole	All	3 µin	0.076 µm	Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.51 µm	20 µin	Board to Board Cable	Push-Pull	74	0.079 in	2 mm	2	-55 °C	125 °C		6.1 mm	UL94 V-0	Forked	0.24 in
Samtec Inc. ESQT-137-03-G-D-310	7.87 mm	0.31 in	0.079 in	2 mm	Phosphor Bronze	Gold	4.5 A	Through Hole	All	3 µin	0.076 µm	Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.51 µm	20 µin	Board to Board Cable	Push-Pull	74	0.079 in	2 mm	2	-55 °C	125 °C	0.148 in	3.76 mm	UL94 V-0	Forked
Samtec Inc. ESQT-137-03-M-D-310	7.87 mm	0.31 in	0.079 in	2 mm	Phosphor Bronze	Tin	4.5 A	Through Hole	All			Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.51 µm	20 µin	Board to Board Cable	Push-Pull	74	0.079 in	2 mm	2	-55 °C	125 °C	0.148 in	3.76 mm	UL94 V-0	Forked
Samtec Inc. ESQT-137-02-M-D-430	10.92 mm	0.43 in	0.079 in	2 mm	Phosphor Bronze	Tin	4.5 A	Through Hole	All			Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.51 µm	20 µin	Board to Board Cable	Push-Pull	74	0.079 in	2 mm	2	-55 °C	125 °C			UL94 V-0	Forked	0.42 in	10.67 mm
Samtec Inc. ESQT-137-02-G-D-720	18.3 mm	0.72 in	0.079 in	2 mm	Phosphor Bronze	Gold	4.5 A	Through Hole	All	3 µin	0.076 µm	Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.51 µm	20 µin	Board to Board Cable	Push-Pull	74	0.079 in	2 mm	2	-55 °C	125 °C	0.13 in	3.3 mm	UL94 V-0	Forked
Samtec Inc. ESQT-137-03-G-Q-408	10.36 mm	0.408 in	0.079 in	2 mm	Phosphor Bronze	Gold	4.5 A	Through Hole	All	3 µin	0.076 µm	Gold	Solder	Elevated Socket	Black	Square	Liquid Crystal Polymer (LCP)	0.51 µm	20 µin	Board to Board Cable	Push-Pull	148	0.079 in	2 mm		-55 °C	125 °C	0.05 in	1.27 mm	UL94 V-0	Forked