Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Type | Mounting Type | Material Flammability Rating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Contact Material - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Solder | 125 °C | -65 ░C | Tin | Beryllium Copper | 200 µin | 5.08 µm | 1 A | PGA ZIF (ZIP) | Through Hole | UL94 V-0 | Closed Frame | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | Beryllium Copper | 0.1 in | 2.54 mm | Gold | 2.54 mm | 0.1 in |