532 Series
Manufacturer: TE Connectivity AMP Connectors
Beta
⌘K
CONN IC DIP SOCKET 32POS GOLD
| Part | Termination Post Length | Contact Resistance | Features | Pitch - Mating | Mounting Type | Row Spacing | Type | Contact Material - Mating | Contact Finish - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Material - Post | Pitch - Post | Termination | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Housing Material | Contact Finish - Post | Contact Finish Thickness - Mating | Material Flammability Rating | Current Rating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 TE Connectivity AMP Connectors | 0.125 in | 10 mOhm | Closed Frame | 0.1 in | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Beryllium Copper | Gold | 125 °C | -55 °C | Brass | 0.1 in | Solder | 16 | 32 | 2 | ||||||
 TE Connectivity AMP Connectors | 0.125 in | 10 mOhm | Closed Frame | 0.1 in | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Copper Alloy | Gold | 125 °C | -55 °C | Copper Alloy | 0.1 in | Solder | 16 | 32 | 2 | Polyester | Gold | 5 µin | UL94 V-0 | 3 A | |
 TE Connectivity AMP Connectors | 0.125 in | Closed Frame | 0.1 in | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Copper Alloy | Gold | 125 °C | -55 °C | Copper Alloy | 0.1 in | Solder | 16 | 32 | 2 | Polyester | Gold | 25 µin | UL94 V-0 | 25 µin |