CONN RCPT 58POS 0.05 GOLD SMD
| Part | Number of Positions Loaded | Style | Insulation Material | Contact Finish - Post | Contact Finish - Mating | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Connector Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material | Contact Type | Mounting Type | Number of Positions | Insulation Height | Insulation Height | Row Spacing - Mating | Row Spacing - Mating | Fastening Type | Pitch - Mating | Pitch - Mating | Termination | Number of Rows | Contact Shape | Insulation Color | Material Flammability Rating | Features | Contact Length - Post [x] | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | All | Board to Board Cable | Liquid Crystal Polymer (LCP) | Tin | Gold | 2.9 A | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Beryllium Copper | Female Socket | Surface Mount | 58 | 0.185 in | 4.7 mm | 0.05 in | 1.27 mm | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Square | Black | UL94 V-0 | |||
Samtec Inc. | All | Board to Board Cable | Liquid Crystal Polymer (LCP) | Tin | Gold | 2.9 A | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Beryllium Copper | Female Socket | Surface Mount | 58 | 0.185 in | 4.7 mm | 0.05 in | 1.27 mm | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Square | Black | UL94 V-0 | Pick and Place | ||
Samtec Inc. | All | Board to Board Cable | Liquid Crystal Polymer (LCP) | Tin | Gold | 2.9 A | -55 °C | 125 °C | Receptacle | 3 µin | 0.076 µm | Beryllium Copper | Female Socket | Through Hole | 58 | 0.18 " | 4.57 mm | 0.05 in | 1.27 mm | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Square | Black | UL94 V-0 | 0.12 in | 3.05 mm | |
Samtec Inc. | All | Board to Board Cable | Liquid Crystal Polymer (LCP) | Tin | Gold | 2.9 A | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Beryllium Copper | Female Socket | Through Hole | 58 | 0.18 " | 4.57 mm | 0.05 in | 1.27 mm | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Square | Black | UL94 V-0 | 0.12 in | 3.05 mm | |
Samtec Inc. | All | Board to Board Cable | Liquid Crystal Polymer (LCP) | Tin | Gold | 2.9 A | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Beryllium Copper | Female Socket | Surface Mount | 58 | 0.185 in | 4.7 mm | 0.05 in | 1.27 mm | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Square | Black | UL94 V-0 |