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CONN IC DIP SOCKET 14POS GOLD
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Type | Type | Type | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish - Post | Features | Termination | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 200 µin | 5.08 µm | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | 0.1 in | 2.54 mm | 14 | Beryllium Copper | 0.4 in | 10.16 mm | DIP | Brass | 2.54 mm | 0.1 in | 105 ░C | -55 °C | 3 A | 3.56 mm | 0.14 in | Tin | Closed Frame | Solder | Gold | 30 Áin | 0.76 Ám |