TMM-111 Series

Catalog

2MM TERMINAL STRIP

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Part	Features	Number of Positions	Connector Type	Contact Finish - Post	Number of Positions Loaded	Insulation Material	Insulation Height	Shrouding	Termination	Mounting Type	Contact Length - Mating	Material Flammability Rating	Contact Type	Number of Rows	Current Rating (Per Contact)	Pitch - Mating	Contact Finish - Mating	Contact Shape	Contact Material	Insulation Color	Style	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Contact Finish Thickness - Mating	Row Spacing - Mating	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Length - Post	Overall Contact Length
Samtec Inc. TMM-111-01-S-S-SM-003-P	Pick and Place	11	Header	Tin	10	Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Surface Mount	0.126 in	UL94 V-0	Male Pin	1	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	30 µin
Samtec Inc. TMM-111-06-G-D-SM-A	Board Guide	22	Header	Gold		Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Surface Mount	0.168 in	UL94 V-0	Male Pin	2	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	20 Ąin	0.079 in	All	3 µin
Samtec Inc. TMM-111-01-T-Q-RA		44	Header	Tin		Liquid Crystal Polymer (LCP)	0.315 in	Unshrouded	Solder	Right Angle Through Hole	0.126 in		Male Pin	4	3.2 A	0.079 in	Tin	Square	Phosphor Bronze	Black	Board Board or Cable	105 °C	-55 °C	Push-Pull		0.079 in	All		0.12 in
Samtec Inc. TMM-111-01-S-D-RA		22	Header	Tin		Liquid Crystal Polymer (LCP)	0.155 in	Unshrouded	Solder	Right Angle Through Hole	0.126 in		Male Pin	2	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	30 µin	0.079 in	All		0.12 in
Samtec Inc. TMM-111-02-G-S		11	Header	Gold		Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Through Hole	0.146 in		Male Pin	1	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	20 Ąin		All	3 µin	0.118 in	0.323 in
Samtec Inc. TMM-111-01-S-D-017		22	Header	Tin	21	Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Through Hole	0.126 in		Male Pin	2	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	30 µin	0.079 in			0.138 in	0.323 in
Samtec Inc. TMM-111-01-F-S-SM-P-TR	Pick and Place	11	Header	Tin		Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Surface Mount	0.126 in	UL94 V-0	Male Pin	1	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	3 µin		All
Samtec Inc. TMM-111-06-G-D-SM-P-TR	Pick and Place	22	Header	Gold		Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Surface Mount	0.168 in	UL94 V-0	Male Pin	2	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	20 Ąin	0.079 in	All	3 µin
Samtec Inc. TMM-111-01-S-D-SM-P	Pick and Place	22	Header	Tin		Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Surface Mount	0.126 in	UL94 V-0	Male Pin	2	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	30 µin	0.079 in	All
Samtec Inc. TMM-111-02-LM-S		11	Header	Tin		Liquid Crystal Polymer (LCP)	0.059 in	Unshrouded	Solder	Through Hole	0.146 in		Male Pin	1	3.2 A	0.079 in	Gold	Square	Phosphor Bronze	Black	Board Board or Cable	125 °C	-55 °C	Push-Pull	10 µin		All		0.118 in	0.323 in