211-1 Series

Manufacturer: CNC Tech

Catalog

CONN IC DIP SOCKET 6POS GOLD

Part	Operating Temperature (Min)	Operating Temperature (Max)	Contact Finish - Post	Housing Material	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Features	Contact Finish Thickness - Post	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Pitch - Post	Row Spacing	Type	Pitch - Mating	Mounting Type	Termination	Contact Finish - Mating	Material Flammability Rating	Current Rating	Termination Post Length	Contact Resistance
CNC Tech 211-1-06-003	-55 °C -40 °C	105 °C	Tin	PBT Polybutylene Terephthalate	Beryllium Copper	10 µin	Brass	Open Frame	200 µin	2	6	3	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Through Hole	Solder	Gold	UL94 V-0	3 A	0.11 in	4 mOhm
CNC Tech 211-1-20-003	-55 °C -40 °C	105 °C	Tin	PBT Polybutylene Terephthalate	Beryllium Copper	10 µin	Brass	Open Frame	200 µin	2	20	10	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Through Hole	Solder	Gold	UL94 V-0	3 A	0.11 in	4 mOhm
CNC Tech 211-1-32-006	-55 °C -40 °C	105 °C	Tin	PBT Polybutylene Terephthalate	Beryllium Copper	10 µin	Brass	Open Frame	200 µin	2	32	16	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	0.1 in	Through Hole	Solder	Gold	UL94 V-0	3 A	0.11 in	4 mOhm
CNC Tech 211-1-18-003	-55 °C -40 °C	105 °C	Tin	PBT Polybutylene Terephthalate	Beryllium Copper	10 µin	Brass	Open Frame	200 µin	2	18	9	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Through Hole	Solder	Gold	UL94 V-0	3 A	0.11 in	4 mOhm
CNC Tech 211-1-08-003	-55 °C -40 °C	105 °C	Tin	PBT Polybutylene Terephthalate	Beryllium Copper	10 µin	Brass	Open Frame	200 µin	2	8	4	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Through Hole	Solder	Gold	UL94 V-0	3 A	0.11 in	4 mOhm
CNC Tech 211-1-14-003	-55 °C -40 °C	105 °C	Tin	PBT Polybutylene Terephthalate	Beryllium Copper	10 µin	Brass	Open Frame	200 µin	2	14	7	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Through Hole	Solder	Gold	UL94 V-0	3 A	0.11 in	4 mOhm
CNC Tech 211-1-40-006	-55 °C -40 °C	105 °C	Tin	PBT Polybutylene Terephthalate	Beryllium Copper	10 µin	Brass	Open Frame	200 µin	2	40	20	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	0.1 in	Through Hole	Solder	Gold	UL94 V-0	3 A	0.11 in	4 mOhm