32-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Termination	Mounting Type	Material Flammability Rating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Features	Type	Type	Type	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Termination Post Length	Termination Post Length	Contact Material - Mating	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-3553-16	Solder	Through Hole	UL94 V-0	2 x 16	32	0.1 in	2.54 mm	Nickel Boron	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	Nickel Boron	1.27 µm	50 µin	2.54 mm	0.1 in	1.27 µm	50 µin	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Beryllium Copper	1 A
Aries Electronics 32-3553-18	Solder	Through Hole	UL94 V-0	2 x 16	32	0.1 in	2.54 mm	Nickel Boron	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Nickel	Nickel Boron	1.27 µm	50 µin	2.54 mm	0.1 in	1.27 µm	50 µin	Polyetheretherketone (PEEK) Glass Filled	0.11 in	2.78 mm	Beryllium Nickel	1 A	-55 °C	250 °C