32-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Termination Post Length	Current Rating	Material Flammability Rating	Features	Row Spacing	Type	Contact Finish Thickness - Post	Pitch - Mating	Contact Finish - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Material - Post	Pitch - Post	Contact Material - Mating	Housing Material	Termination	Mounting Type	Contact Finish Thickness - Mating	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 32-3553-16	0.11 in	1 A	UL94 V-0	Closed Frame	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	0.1 in	Nickel Boron	16	32	2	Beryllium Copper	0.1 in	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	Solder	Through Hole	50 µin	Boron Nickel
Aries Electronics 32-3553-18	0.11 in	1 A	UL94 V-0	Closed Frame	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	0.1 in	Nickel Boron	16	32	2	Beryllium Nickel	0.1 in	Beryllium Nickel	Glass Filled PEEK Polyetheretherketone	Solder	Through Hole	50 µin	Boron Nickel	250 °C	-55 °C
Aries Electronics 32-3553-10	0.11 in	1 A	UL94 V-0	Closed Frame	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	200 µin	0.1 in	Tin	16	32	2	Beryllium Copper	0.1 in	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	Solder	Through Hole	200 Ąin	Tin