CONN EDGE DUAL FMALE 80POS 0.05
| Part | Card Thickness | Card Thickness | Number of Positions | Mounting Type | Read Out | Gender | Number of Rows | Termination | Material - Insulation | Color | Contact Type | Card Type | Features | Contact Finish Thickness | Contact Finish Thickness | Contact Material | Pitch [x] | Pitch [x] | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.062 in | 1.57 mm | 80 | Surface Mount | Dual | Female | 2 | Solder | Liquid Crystal Polymer (LCP) | Black | Cantilever | Non Specified - Dual Edge | Board Guide | 10 Áin | 0.25 Ám | Beryllium Copper | 0.05 in | 1.27 mm | -55 °C | 125 °C | Gold |
Samtec Inc. | 0.093 in | 2.36 mm | 80 | Surface Mount | Dual | Female | 2 | Solder | Liquid Crystal Polymer (LCP) | Natural | Cantilever | Non Specified - Dual Edge | Board Guide | 10 Áin | 0.25 Ám | Beryllium Copper | 0.05 in | 1.27 mm | -55 °C | 125 °C | Gold |
Samtec Inc. | 0.062 in | 1.57 mm | 80 | Surface Mount | Dual | Female | 2 | Solder | Liquid Crystal Polymer (LCP) | Black | Cantilever | Non Specified - Dual Edge | Board Guide | 10 Áin | 0.25 Ám | Beryllium Copper | 0.05 in | 1.27 mm | -55 °C | 125 °C | Gold |
Samtec Inc. | 0.062 in | 1.57 mm | 80 | Surface Mount | Dual | Female | 2 | Solder | Liquid Crystal Polymer (LCP) | Black | Cantilever | Non Specified - Dual Edge | Board Guide | 10 Áin | 0.25 Ám | Beryllium Copper | 0.05 in | 1.27 mm | -55 °C | 125 °C | Gold |