163A169 Series
Manufacturer: McGill Microwave Systems
Beta
⌘K
CONN D-SUB HD PLUG 44P VERT SLDR
| Part | Contact Finish Thickness | Contact Finish | Current Rating | Connector Style | Contact Type | Termination | Connector Type | Shell Size | Connector Layout | Features | Flange Feature | Mounting Type | Ingress Protection | Finish | Shell Material | Number of Rows | Number of Positions | Material Flammability Rating | Color | Voltage Rating | Dielectric Material | Operating Temperature (Max) | Operating Temperature (Min) | Contact Material | Contact Finish Thickness (string set options) | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 McGill Microwave Systems | 8 µin | Gold | 3 A | D-Sub High Density | Signal | Solder | Male Pins Plug | 3 | B DB High Density | Board Lock Grounding Indents | Board Side (4-40) | Through Hole | IP20 | Tin Plated | Steel | 3 | 44 | UL94 V-0 | Black | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Copper Alloy | ||
McGill Microwave Systems | 0 | Gold | 3 A | D-Sub High Density | Signal | Solder | Male Pins Plug | 3 | B DB High Density | Grounding Indents | Board Side (M3) Mating Side (4-40) | Through Hole | IP20 | Tin Plated | Steel | 3 | 44 | UL94 V-0 | Black | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Copper Alloy | Flash | Flash |
 McGill Microwave Systems | 8 µin | Gold | 3 A | D-Sub High Density | Signal | Solder | Male Pins Plug | 1 | DE E High Density | Board Lock Grounding Indents | Board Side (4-40) | Through Hole | IP20 | Tin Plated | Steel | 3 | 15 | UL94 V-0 | Black | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Copper Alloy | ||
 McGill Microwave Systems | 8 µin | Gold | 3 A | D-Sub High Density | Signal | Solder | Male Pins Plug | 5 | D DD High Density | Board Lock Grounding Indents | Board Side (4-40) | Through Hole | IP20 | Tin Plated | Steel | 4 | 78 | UL94 V-0 | Black | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Copper Alloy | ||
McGill Microwave Systems | 8 µin | Gold | 3 A | D-Sub High Density | Signal | Solder | Male Pins Plug | 4 | C DC High Density | Board Lock Grounding Indents | Board Side (4-40) | Through Hole | IP20 | Tin Plated | Steel | 3 | 62 | UL94 V-0 | Black | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Copper Alloy | ||
McGill Microwave Systems | 0 | Gold | 3 A | D-Sub High Density | Signal | Solder | Male Pins Plug | 5 | D DD High Density | Grounding Indents | Board Side (M3) Mating Side (4-40) | Through Hole | IP20 | Tin Plated | Steel | 4 | 78 | UL94 V-0 | Black | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Copper Alloy | Flash | Flash |
 McGill Microwave Systems | 8 µin | Gold | 3 A | D-Sub High Density | Signal | Solder | Male Pins Plug | 2 | A DA High Density | Board Lock Grounding Indents | Board Side (4-40) | Through Hole | IP20 | Tin Plated | Steel | 3 | 26 | UL94 V-0 | Black | 60 V | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Copper Alloy |