17EBH044 Series
Manufacturer: Amphenol ICC (Commercial Products)
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⌘K
CONN D-SUB HD RCPT 44P R/A SLDR
| Part | Mounting Type | Connector Style | Number of Positions | Termination | Shell Material | Finish | Contact Type | Flange Feature | Shell Size | Connector Layout | Contact Finish Thickness | Number of Rows | Connector Type | Features | Contact Finish | Backset Spacing | Current Rating | Material Flammability Rating | Voltage Rating | Color | Operating Temperature (Min) | Operating Temperature (Max) | Contact Form | Dielectric Material | Contact Material | Contact Finish Thickness (string set options) | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Amphenol ICC (Commercial Products) | Right Angle Through Hole | D-Sub High Density | 44 | Solder | Steel | Nickel Plated | Signal | Housing Shell (4-40) | 3 | B DB High Density | 30 µin | 3 | Female Sockets Receptacle | Board Lock | Gold | 0.35 in | 3 A | UL94 V-0 | 125 V | Black | -55 °C | 105 °C | Stamped | Glass Filled Nylon Polyamide (PA) | Copper Alloy | ||
Amphenol ICC (Commercial Products) | Right Angle Through Hole | D-Sub High Density | 44 | Solder | Steel | Nickel Plated | Signal | Female Screwlock (4-40) Mating Side | 3 | B DB High Density | 30 µin | 3 | Female Sockets Receptacle | Board Lock | Gold | 0.35 in | 3 A | UL94 V-0 | 125 V | Black | -55 °C | 105 °C | Stamped | Glass Filled Nylon Polyamide (PA) | Copper Alloy | ||
 Amphenol ICC (Commercial Products) | Right Angle Through Hole | D-Sub High Density | 44 | Solder | Steel | Nickel Plated | Signal | Housing Shell (4-40) | 3 | B DB High Density | 0 | 3 | Male Pins Plug | Board Lock Grounding Indents | Gold | 0.35 in | 3 A | UL94 V-0 | 125 V | Black | -55 °C | 105 °C | Stamped | Glass Filled Nylon Polyamide (PA) | Copper Alloy | Flash | Flash |
 Amphenol ICC (Commercial Products) | Right Angle Through Hole | D-Sub High Density | 44 | Solder | Steel | Nickel Plated | Signal | Housing Shell (Unthreaded) | 3 | B DB High Density | 30 µin | 3 | Male Pins Plug | Board Lock Grounding Indents | Gold | 0.35 in | 3 A | UL94 V-0 | 125 V | Black | -55 °C | 105 °C | Stamped | Glass Filled Nylon Polyamide (PA) | Copper Alloy | ||
Amphenol ICC (Commercial Products) | Right Angle Through Hole | D-Sub High Density | 44 | Solder | Steel | Nickel Plated | Signal | Housing Shell (4-40) | 3 | B DB High Density | 0 | 3 | Female Sockets Receptacle | Board Lock | Gold | 0.35 in | 3 A | UL94 V-0 | 125 V | Black | -55 °C | 105 °C | Stamped | Glass Filled Nylon Polyamide (PA) | Copper Alloy | Flash | Flash |
 Amphenol ICC (Commercial Products) | Right Angle Through Hole | D-Sub High Density | 44 | Solder | Steel | Nickel Plated | Signal | Female Screwlock (4-40) Mating Side | 3 | B DB High Density | 30 µin | 3 | Male Pins Plug | Board Lock Grounding Indents | Gold | 0.35 in | 3 A | UL94 V-0 | 125 V | Black | -55 °C | 105 °C | Stamped | Glass Filled Nylon Polyamide (PA) | Copper Alloy |