CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Termination Post Length | Termination Post Length | Features | Material Flammability Rating | Termination | Contact Finish - Mating | Current Rating (Amps) | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Mounting Type | Type | Type | Type | Housing Material | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6554-11 | 0.11 in | 2.78 mm | Closed Frame | UL94 V-0 | Solder | Gold | 1 A | Beryllium Copper | 0.1 in | 2.54 mm | Beryllium Copper | 48 | Through Hole | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Polyphenylene Sulfide (PPS), Glass Filled | 2.54 mm | 0.1 in | Gold | ||||||
Aries Electronics 48-6554-16 | 0.11 in | 2.78 mm | Closed Frame | UL94 V-0 | Solder | Nickel Boron | 1 A | Beryllium Copper | 0.1 in | 2.54 mm | Beryllium Copper | 48 | Through Hole | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Polyphenylene Sulfide (PPS), Glass Filled | 2.54 mm | 0.1 in | Nickel Boron | 1.27 µm | 50 µin | 1.27 µm | 50 µin | ||
Aries Electronics 48-6554-18 | 0.11 in | 2.78 mm | Closed Frame | UL94 V-0 | Solder | Nickel Boron | 1 A | Beryllium Nickel | 0.1 in | 2.54 mm | Beryllium Nickel | 48 | Through Hole | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Polyetheretherketone (PEEK), Glass Filled | 2.54 mm | 0.1 in | Nickel Boron | 1.27 µm | 50 µin | 1.27 µm | 50 µin | -55 °C | 250 °C |