48-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Contact Finish - Post	Contact Material - Mating	Row Spacing	Type	Pitch - Post	Contact Finish - Mating	Contact Material - Post	Pitch - Mating	Housing Material	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Features	Mounting Type	Termination	Current Rating	Termination Post Length	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 48-6554-11	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Gold	Beryllium Copper	0.1 in	Glass Filled Polyphenylene Sulfide PPS	48	24	2	Closed Frame	Through Hole	Solder	1 A	0.11 in	UL94 V-0
Aries Electronics 48-6554-16	Nickel Boron	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Boron Nickel	Beryllium Copper	0.1 in	Glass Filled Polyphenylene Sulfide PPS	48	24	2	Closed Frame	Through Hole	Solder	1 A	0.11 in	UL94 V-0	50 µin	50 µin
Aries Electronics 48-6554-18	Nickel Boron	Beryllium Nickel	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Boron Nickel	Beryllium Nickel	0.1 in	Glass Filled PEEK Polyetheretherketone	48	24	2	Closed Frame	Through Hole	Solder	1 A	0.11 in	UL94 V-0	50 µin	50 µin	250 °C	-55 °C