D10650 Series
Manufacturer: Wakefield Thermal Solutions
HEAT SINK, BGA, 16.5 MM, 10.21 MM, 16.5 MM
| Part | Width | Power Dissipation | Length | Package Cooled | Material | Attachment Method | Thermal Resistance | Fin Height | Type | Shape |
|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | 0.65 in | 2 W | 0.65 in | BGA | Composite | Adhesive (Not Included) Thermal Tape | 25 °C/W | 0.4 in | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 0.65 in | 2 W | 0.65 in | BGA | Composite | Adhesive (Included) Thermal Tape | 25 °C/W | 0.4 in | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 0.65 in | 2 W | 0.65 in | BGA | Composite | Adhesive (Included) Thermal Tape | 25 °C/W | 0.4 in | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 0.65 in | 2 W | 0.65 in | BGA | Composite | Adhesive (Not Included) Thermal Tape | 25 °C/W | 0.4 in | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 0.65 in | 2 W | 0.65 in | BGA | Composite | Adhesive (Included) Thermal Tape | 25 °C/W | 0.4 in | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 0.65 in | 2 W | 0.65 in | BGA | Composite | Adhesive (Included) Thermal Tape | 25 °C/W | 0.4 in | Top Mount | Pin Fins Square |