SIP1X02 Series

Catalog

CONN SOCKET SIP 2POS GOLD

Part	Material Flammability Rating	Termination Post Length	Pitch - Post	Type	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Contact Material - Mating	Contact Finish Thickness - Mating	Features	Mounting Type	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Contact Finish - Mating	Termination
Amphenol ICC (FCI) SIP1X02-001BLF	UL94 V-0	0.125 in	0.1 in	SIP	0.1 in	Tin	200 µin	Brass	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	30 µin	Closed Frame	Through Hole	2	1	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-041BLF	UL94 V-0	0.125 in	0.1 in	SIP	0.1 in	Tin	200 µin	Brass	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	30 µin	Closed Frame	Through Hole	2	1	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-011BLF	UL94 V-0	0.125 in	0.1 in	SIP	0.1 in	Tin	200 µin	Brass	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	10 µin	Closed Frame	Through Hole	2	1	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-001B	UL94 V-0	0.125 in	0.1 in	SIP	0.1 in	Tin-Lead	200 µin	Brass	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	30 µin	Closed Frame	Through Hole	2	1	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-011B	UL94 V-0	0.125 in	0.1 in	SIP	0.1 in	Tin-Lead	200 µin	Brass	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	10 µin	Closed Frame	Through Hole	2	1	2	Gold	Solder
Amphenol ICC (FCI) SIP1X02-041B	UL94 V-0	0.125 in	0.1 in	SIP	0.1 in	Tin-Lead	200 µin	Brass	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	30 µin	Closed Frame	Through Hole	2	1	2	Gold	Solder