FUSE CHIP SLOW BLOW ACTING 1.25A 250V SMD SOLDER PAD 11 X 4.6 X 3.9MM THERMOPLASTIC BAG CULUS
| Part | Melting I˛t | Mounting Type | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | Size / Dimension [z] | Size / Dimension [z] | Current Rating (Amps) | Response Time | Package / Case | Fuse Type | Breaking Capacity @ Rated Voltage | Operating Temperature [Min] | Operating Temperature [Max] | Voltage Rating - AC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SCHURTER Inc. 3403.0117.24 | 1 | Surface Mount | 4.6 mm | 0.181 in | 0.433 in | 11 mm | 3.9 mm | 0.154 in | 1.25 A | Slow Blow | 2-SMD, J-Lead | Board Mount | 100 A | -55 °C | 125 °C | 250 V |