IC FLSH 512GBIT EMMC 5.1 100FBGA
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Memory Format | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Type | Memory Organization | Memory Interface | Package / Case | Clock Frequency | Memory Size | Technology | Mounting Type | Supplier Device Package [x] | Supplier Device Package | Supplier Device Package [y] | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Flexxon Pte Ltd  | 85 °C  | -40 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC_5.1  | 100-LBGA  | 200 MHz  | 64 MB  | FLASH - NAND (TLC)  | Surface Mount  | |||
Flexxon Pte Ltd  | 85 °C  | -25 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC  | 153-VFBGA  | 200 MHz  | 64 MB  | FLASH - NAND (TLC)  | Surface Mount  | 11.5  | 153-FBGA  | 13  | 
Flexxon Pte Ltd  | 85 °C  | -40 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC  | 153-VFBGA  | 200 MHz  | 64 MB  | FLASH - NAND (MLC)  | Surface Mount  | 11.5  | 153-FBGA  | 13  | 
Flexxon Pte Ltd  | 85 °C  | -40 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC_5.1  | 100-LBGA  | 200 MHz  | 64 MB  | FLASH - NAND (TLC)  | Surface Mount  | |||
Flexxon Pte Ltd  | 85 °C  | -40 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC  | 153-VFBGA  | 200 MHz  | 64 MB  | FLASH - NAND (TLC)  | Surface Mount  | 11.5  | 153-FBGA  | 13  | 
Flexxon Pte Ltd  | 85 °C  | -40 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC_5.1  | 153-VFBGA  | 200 MHz  | 64 MB  | FLASH - NAND (TLC)  | Surface Mount  | 11.5  | 153-FBGA  | 13  | 
Flexxon Pte Ltd  | 105 ░C  | -40 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC_5.1  | 100-LBGA  | 200 MHz  | 64 MB  | FLASH - NAND (TLC)  | Surface Mount  | |||
Flexxon Pte Ltd  | 85 °C  | -25 °C  | FLASH  | 2.7 V  | 3.6 V  | Non-Volatile  | 64 G  | eMMC_5.1  | 153-VFBGA  | 200 MHz  | 64 MB  | FLASH - NAND (TLC)  | Surface Mount  | 11.5  | 153-FBGA  | 13  |