518 Series

Catalog

IC & COMPONENT SOCKETS SURFACE MOUNT 6 PIN

Part	Current Rating	Termination Post Length	Material Flammability Rating	Housing Material	Pitch - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Material - Post	Pitch - Post	Termination	Row Spacing	Type	Contact Finish - Mating	Contact Finish Thickness - Post	Mounting Type	Contact Finish - Post	Features
Aries Electronics 06-3518-00	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	6	3	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	200 µin	Surface Mount	Tin	Open Frame
Aries Electronics 48-6518-11H	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	48	24	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	10 µin	Through Hole	Gold	Open Frame
Aries Electronics 20-4518-10T	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	20	10	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.4 in	0.4" (10.16mm) Row Spacing DIP	Gold	200 µin	Through Hole	Tin	Open Frame
Aries Electronics 24-3518-112	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	24	12	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	10 µin	Through Hole	Gold	Open Frame
Aries Electronics 24-6518-10M	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	24	12	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	200 µin	Through Hole	Tin	Open Frame
Aries Electronics 20-4518-10M	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	20	10	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.4 in	0.4" (10.16mm) Row Spacing DIP	Gold	200 µin	Through Hole	Tin	Open Frame
Aries Electronics 64-9518-10	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	64	32	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.9 in	0.9" (22.86mm) Row Spacing DIP	Gold	200 µin	Through Hole	Tin	Open Frame
Aries Electronics 24-4518-10E	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	24	12	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.4 in	0.4" (10.16mm) Row Spacing DIP	Gold	200 µin	Through Hole	Tin	Open Frame
Aries Electronics 06-3518-10				Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	6	3	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	200 µin	Through Hole	Tin	Open Frame
Aries Electronics 24-6518-10T	3 A	0.125 in	UL94 V-0	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	2	24	12	10 µin	Beryllium Copper	Brass	0.1 in	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	200 µin	Through Hole	Tin	Open Frame