CONN IC DIP SOCKET ZIF 48POS
| Part | Mounting Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Finish - Mating | Type | Type | Type | Number of Positions or Pins (Grid) | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Features | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Termination | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6570-16 | Through Hole | Nickel Boron | 0.1 in | 2.54 mm | Beryllium Nickel | Nickel Boron | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 48 | Beryllium Nickel | 1.27 µm | 50 µin | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 0.11 in | 2.78 mm | 1 A | 1.27 µm | 50 µin | 2.54 mm | 0.1 in | Solder | UL94 V-0 |
Aries Electronics 48-6570-10 | Through Hole | Tin | 0.1 in | 2.54 mm | Beryllium Copper | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 48 | Beryllium Copper | 5.08 µm | 200 µin | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 0.11 in | 2.78 mm | 1 A | 5.08 µm | 200 µin | 2.54 mm | 0.1 in | Solder | UL94 V-0 |