CONN HEADER SMD 26POS 1.27MM
| Part | Connector Type | Contact Material | Mounting Type | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Shrouding | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Insulation Height | Insulation Height | Contact Finish - Post | Number of Rows | Insulation Color | Contact Finish - Mating | Features | Termination | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Mating | Contact Length - Mating | Fastening Type | Insulation Material | Contact Type | Contact Length - Mating [x] | Row Spacing - Mating [x] | Row Spacing - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Header | Phosphor Bronze | Surface Mount | 0.05 in | 1.27 mm | 3.1 A | Unshrouded | All | 10 çin | 0.25 çm | 26 | -55 °C | 125 °C | Square | 0.1 in | 2.54 mm | Gold | 1 | Black | Gold | Pick and Place | Solder | UL94 V-0 | 3 µin | 0.076 µm | 5.21 mm | 0.205 in | Push-Pull | Liquid Crystal Polymer (LCP) | Male Pin | |||
Samtec Inc. | Header | Phosphor Bronze | Surface Mount | 0.05 in | 1.27 mm | 3.1 A | Unshrouded | All | 52 | -55 °C | 125 °C | Square | 0.1 in | 2.54 mm | Tin | 2 | Black | Board Guide | Solder | UL94 V-0 | 5.84 mm | Push-Pull | Liquid Crystal Polymer (LCP) | Male Pin | 0.23 in | 2.54 mm | 0.1 in | ||||||
Samtec Inc. | Header | Phosphor Bronze | Surface Mount | 0.05 in | 1.27 mm | 3.1 A | Unshrouded | All | 10 çin | 0.25 çm | 52 | -55 °C | 125 °C | Square | 0.1 in | 2.54 mm | Gold | 2 | Black | Gold | Board Guide | Solder | UL94 V-0 | 3 µin | 0.076 µm | 5.84 mm | Push-Pull | Liquid Crystal Polymer (LCP) | Male Pin | 0.23 in | 2.54 mm | 0.1 in | |
Samtec Inc. | Header | Phosphor Bronze | Surface Mount | 0.05 in | 1.27 mm | 3.1 A | Unshrouded | All | 30 Áin | 0.76 Ám | 52 | -55 °C | 125 °C | Square | 0.1 in | 2.54 mm | Tin | 2 | Black | Gold | Pick and Place | Solder | UL94 V-0 | 5.21 mm | 0.205 in | Push-Pull | Liquid Crystal Polymer (LCP) | Male Pin | 2.54 mm | 0.1 in | |||
Samtec Inc. | Header | Phosphor Bronze | Surface Mount | 0.05 in | 1.27 mm | 3.1 A | Unshrouded | All | 30 Áin | 0.76 Ám | 52 | -55 °C | 125 °C | Square | 0.1 in | 2.54 mm | Tin | 2 | Black | Gold | Board Guide Pick and Place | Solder | UL94 V-0 | 5.21 mm | 0.205 in | Push-Pull | Liquid Crystal Polymer (LCP) | Male Pin | 2.54 mm | 0.1 in | |||
Samtec Inc. | Header | Phosphor Bronze | Surface Mount | 0.05 in | 1.27 mm | 3.1 A | Unshrouded | All | 30 Áin | 0.76 Ám | 26 | -55 °C | 125 °C | Square | 0.1 in | 2.54 mm | Tin | 1 | Black | Gold | Solder | UL94 V-0 | 4.83 mm | 0.19 " | Push-Pull | Liquid Crystal Polymer (LCP) | Male Pin | ||||||
Samtec Inc. | Header | Phosphor Bronze | Surface Mount | 0.05 in | 1.27 mm | 3.1 A | Unshrouded | All | 10 çin | 0.25 çm | 52 | -55 °C | 125 °C | Square | 0.1 in | 2.54 mm | Tin | 2 | Black | Gold | Pick and Place | Solder | UL94 V-0 | 2.54 mm | 0.1 in | Push-Pull | Liquid Crystal Polymer (LCP) | Male Pin | 2.54 mm | 0.1 in |