IC FLASH 1GBIT SPI/QUAD 16SOIC
| Part | Memory Type | Package / Case [x] | Package / Case | Package / Case [y] | Access Time | Memory Size | Voltage - Supply [Max] | Voltage - Supply [Min] | Write Cycle Time - Word, Page | Memory Interface | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Technology | Memory Organization | Mounting Type | Clock Frequency | Memory Format |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25Q01NWSFIQ | Non-Volatile | 0.295 in | 16-SOIC | 7.5 mm | 7 ns | 1 Mbit | 1.95 V | 1.7 V | 3 ms | SPI - Quad I/O | 16-SOIC | 85 °C | -40 °C | FLASH - NOR | 128 M | Surface Mount | 133 MHz | FLASH |
Winbond Electronics W25Q01JVZEIQ | Non-Volatile | 8-WDFN Exposed Pad | 1 Mbit | 3.6 V | 2.7 V | 3.5 ms | SPI - Quad I/O | 8-WSON (8x6) | 85 °C | -40 °C | FLASH - NOR | 128 M | Surface Mount | 133 MHz | FLASH | |||
Winbond Electronics W25Q01NWTBIQ | Non-Volatile | 24-TBGA | 7 ns | 1 Mbit | 1.95 V | 1.7 V | 3 ms | QPI, Quad I/O, SPI | 24-TFBGA (8x6) | 85 °C | -40 °C | FLASH - NOR | 128 M | Surface Mount | 133 MHz | FLASH | ||
Winbond Electronics W25Q01JVTBIQ | Non-Volatile | 24-TBGA | 7.5 ns | 1 Mbit | 3.6 V | 2.7 V | 3.5 ms | SPI - Quad I/O | 24-TFBGA (8x6) | 85 °C | -40 °C | FLASH - NOR | 128 M | Surface Mount | 133 MHz | FLASH | ||
Winbond Electronics W25Q01NWSFIQ TR | Non-Volatile | 0.295 in | 16-SOIC | 7.5 mm | 7 ns | 1 Mbit | 1.95 V | 1.7 V | 3 ms | QPI, Quad I/O, SPI | 16-SOIC | 85 °C | -40 °C | FLASH - NOR | 128 M | Surface Mount | 133 MHz | FLASH |
Winbond Electronics W25Q01NWTBIM TR | Non-Volatile | 24-TBGA | 7 ns | 1 Mbit | 1.95 V | 1.7 V | 3 ms | QPI, Quad I/O, SPI | 24-TFBGA (8x6) | 85 °C | -40 °C | FLASH - NOR | 128 M | Surface Mount | 133 MHz | FLASH |