CONN HEADER SMD 4POS 1.27MM
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Connector Type | Insulation Material | Current Rating (Amps) | Contact Finish - Post | Contact Finish - Mating | Fastening Type | Pitch - Mating | Pitch - Mating | Contact Type | Insulation Color | Contact Material | Operating Temperature [Min] | Operating Temperature [Max] | Shrouding | Contact Length - Mating | Contact Length - Mating | Number of Positions Loaded | Mounting Type | Termination | Insulation Height | Insulation Height | Contact Shape | Number of Rows | Material Flammability Rating | Number of Positions | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Length - Mating [x] | Contact Length - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 10 çin | 0.25 çm | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.19 " | 4.83 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | ||||||
Samtec Inc. | 10 çin | 0.25 çm | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Gold | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.1 in | 2.54 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | 3 µin | 0.076 µm | ||||
Samtec Inc. | 30 Áin | 0.76 Ám | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.19 " | 4.83 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | ||||||
Samtec Inc. | 30 Áin | 0.76 Ám | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 5.84 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 2 | UL94 V-0 | 8 | 2.54 mm | 0.1 in | 0.23 in | ||||
Samtec Inc. | 10 çin | 0.25 çm | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.39 in | 9.91 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | ||||||
Samtec Inc. | 10 çin | 0.25 çm | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.205 in | 5.21 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | ||||||
Samtec Inc. | 30 Áin | 0.76 Ám | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.43 in | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | 10.92 mm | ||||||
Samtec Inc. | 10 çin | 0.25 çm | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.19 " | 4.83 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 2 | UL94 V-0 | 8 | 2.54 mm | 0.1 in | ||||
Samtec Inc. | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Tin | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.1 in | 2.54 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | |||||||||
Samtec Inc. | 10 çin | 0.25 çm | Header | Liquid Crystal Polymer (LCP) | 3.1 A | Gold | Gold | Push-Pull | 0.05 in | 1.27 mm | Male Pin | Black | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 0.19 " | 4.83 mm | All | Surface Mount | Solder | 0.1 in | 2.54 mm | Square | 1 | UL94 V-0 | 4 | 3 µin | 0.076 µm |