FTR-104 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 4POS 1.27MM
| Part | Contact Material | Insulation Height | Operating Temperature (Max) | Operating Temperature (Min) | Current Rating (Per Contact) | Number of Positions | Contact Finish - Mating | Pitch - Mating | Style | Shrouding | Contact Shape | Number of Positions Loaded | Termination | Contact Length - Mating | Insulation Material | Insulation Color | Number of Rows | Fastening Type | Contact Type | Contact Finish Thickness - Mating | Mounting Type | Contact Finish - Post | Material Flammability Rating | Connector Type | Contact Finish Thickness - Post | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.19 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | 10 µin | Surface Mount | Tin | UL94 V-0 | Header | ||
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.1 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | 10 µin | Surface Mount | Gold | UL94 V-0 | Header | 3 µin | |
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.19 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | 30 µin | Surface Mount | Tin | UL94 V-0 | Header | ||
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.39 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | 10 µin | Surface Mount | Tin | UL94 V-0 | Header | ||
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.205 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | 10 µin | Surface Mount | Tin | UL94 V-0 | Header | ||
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.43 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | 30 µin | Surface Mount | Tin | UL94 V-0 | Header | ||
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 8 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.19 in | Liquid Crystal Polymer (LCP) | Black | 2 | Push-Pull | Male Pin | 10 µin | Surface Mount | Tin | UL94 V-0 | Header | 0.1 in | |
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Tin | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.1 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | Surface Mount | Tin | UL94 V-0 | Header | |||
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 4 | Gold | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.1 in | Liquid Crystal Polymer (LCP) | Black | 1 | Push-Pull | Male Pin | 30 µin | Surface Mount | Tin | UL94 V-0 | Header | ||
Samtec Inc. | Phosphor Bronze | 0.1 in | 125 °C | -55 °C | 3.1 A | 8 | Tin | 0.05 in | Board | Unshrouded | Square | All | Solder | 0.19 in | Liquid Crystal Polymer (LCP) | Black | 2 | Push-Pull | Male Pin | Surface Mount | Tin | UL94 V-0 | Header | 0.1 in |