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18P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Contact Material - Post [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Type | Type | Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Termination | Current Rating (Amps) | Pitch - Post | Pitch - Post | Contact Finish - Mating | Contact Material - Mating | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | 105 ░C | -55 °C | DIP | 0.6 in | 15.24 mm | Gold | 0.1 in | 2.54 mm | 3.56 mm | 0.14 in | 18 | 30 Áin | 0.76 Ám | UL94 V-0 | Solder | 3 A | 2.54 mm | 0.1 in | Gold | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | Through Hole | Closed Frame Elevated |