32-9503 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Pitch - Post	Pitch - Post	Contact Finish - Mating	Type	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Termination	Pitch - Mating	Pitch - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Current Rating (Amps)	Material Flammability Rating	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length [x]	Termination Post Length [x]	Contact Finish - Post	Termination Post Length	Termination Post Length
Aries Electronics 32-9503-21	Through Hole	10 çin	0.25 çm	Phosphor Bronze	2.54 mm	0.1 in	Gold	22.86 mm	DIP	0.9 in	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Beryllium Copper	3 A	UL94 V-0	-55 °C	125 °C	0.36 in	9.14 mm	Gold
Aries Electronics 32-9503-31	Through Hole	10 çin	0.25 çm	Phosphor Bronze	2.54 mm	0.1 in	Gold	22.86 mm	DIP	0.9 in	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Beryllium Copper	3 A	UL94 V-0	-55 °C	125 °C			Gold	0.5 in	12.7 mm
Aries Electronics 32-9503-20	Through Hole	200 µin	5.08 µm	Phosphor Bronze	2.54 mm	0.1 in	Gold	22.86 mm	DIP	0.9 in	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Beryllium Copper	3 A	UL94 V-0	-55 °C	105 ░C	0.36 in	9.14 mm	Tin
Aries Electronics 32-9503-30	Through Hole	200 µin	5.08 µm	Phosphor Bronze	2.54 mm	0.1 in	Gold	22.86 mm	DIP	0.9 in	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Beryllium Copper	3 A	UL94 V-0	-55 °C	105 ░C			Tin	0.5 in	12.7 mm