CONN HEADER SMD 20POS 1.27MM
| Part | Contact Shape | Number of Positions | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Material | Number of Rows | Material Flammability Rating | Contact Type | Number of Positions Loaded | Termination | Contact Material | Insulation Color | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Voltage Rating | Mounting Type | Row Spacing - Mating | Row Spacing - Mating | Connector Type | Contact Finish - Mating | Current Rating (Amps) | Fastening Type | Shrouding | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Length - Mating | Contact Length - Mating | Features | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Square | 20 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 10 çin | 0.25 çm | 3.05 mm | 0.12 in | ||
Amphenol ICC (FCI) | Square | 24 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 3.05 mm | 0.12 in | Pick and Place | Flash | ||
Amphenol ICC (FCI) | Square | 18 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold GXT™ | 1 A | Push-Pull | Unshrouded | 30 Áin | 0.76 Ám | 3.05 mm | 0.12 in | ||
Amphenol ICC (FCI) | Square | 10 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 3.05 mm | 0.12 in | Pick and Place | Flash | ||
Amphenol ICC (FCI) | Square | 36 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 10 çin | 0.25 çm | 3.05 mm | 0.12 in | ||
Amphenol ICC (FCI) | Square | 80 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 3.05 mm | 0.12 in | Pick and Place | Flash | ||
Amphenol ICC (FCI) | Square | 24 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 10 çin | 0.25 çm | 3.05 mm | 0.12 in | Pick and Place | |
Amphenol ICC (FCI) | Square | 90 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 10 çin | 0.25 çm | 3.05 mm | 0.12 in | Board Guide | |
Amphenol ICC (FCI) | Square | 12 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold | 1 A | Push-Pull | Unshrouded | 10 çin | 0.25 çm | 3.05 mm | 0.12 in | ||
Amphenol ICC (FCI) | Square | 10 | 0.05 in | 1.27 mm | -55 °C | 125 °C | Thermoplastic | 2 | UL94 V-0 | Male Pin | All | Solder | Copper Alloy | Black | Tin | 1.27 µm | 50 µin | 125 VAC | Surface Mount | 0.05 in | 1.27 mm | Header | Gold GXT™ | 1 A | Push-Pull | Unshrouded | 30 Áin | 0.76 Ám | 3.05 mm | 0.12 in | Pick and Place |