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CONN IC DIP SOCKET 18POS GOLD
| Part | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Material - Mating | Type | Type | Type | Pitch - Mating | Pitch - Mating | Features | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Current Rating (Amps) | Housing Material | Number of Positions or Pins (Grid) | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Solder | 30 Áin | 0.76 Ám | Gold | 105 ░C | -55 °C | UL94 V-0 | 3.56 mm | 0.14 in | Beryllium Copper | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Closed Frame Elevated | Gold | 10 çin | 0.25 çm | Brass | 2.54 mm | 0.1 in | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 18 | Through Hole |