26-8125 Series

Catalog

CONN IC DIP SOCKET 26POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Row Spacing	Type	Mounting Type	Contact Material - Mating	Housing Material	Number of Positions or Pins (Grid)	Grid Rows	Grid Columns	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Pitch - Post	Contact Material - Post	Contact Finish Thickness - Mating	Termination	Operating Temperature (Min)	Operating Temperature (Max)	Pitch - Mating	Features
Aries Electronics 26-81250-310C	0.14 in	UL94 V-0	3 A	0.3 in	0.3" (7.62mm) Row Spacing DIP	Through Hole	Beryllium Copper	Glass Filled Nylon 4/6 PA46 Polyamide	26	2	13	10 µin	Gold	Gold	0.1 in	Brass	30 µin	Solder	-55 °C	105 °C	0.1 in	Closed Frame Elevated
Aries Electronics 26-81250-610C	0.14 in	UL94 V-0	3 A	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	Beryllium Copper	Glass Filled Nylon 4/6 PA46 Polyamide	26	2	13	10 µin	Gold	Gold	0.1 in	Brass	30 µin	Solder	-55 °C	105 °C	0.1 in	Closed Frame Elevated