PGA GOLD BERYLLIUM COPPER ALLOY -65℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Material - Post | Features | Material Flammability Rating | Termination Post Length | Termination Post Length | Termination | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics  | 1 A  | 0.1 in  | 2.54 mm  | Through Hole  | 30 Áin  | 0.76 Ám  | Tin  | PGA  ZIF (ZIP)  | 200 µin  | 5.08 µm  | Gold  | 125 °C  | -65 ░C  | 2.54 mm  | 0.1 in  | Beryllium Copper  | Beryllium Copper  | Closed Frame  | UL94 V-0  | 3.18 mm  | 0.125 in  | Solder  |