625-60 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK FOR 25MM BGA
| Part | Package Cooled | Thermal Resistance | Fin Height | Shape | Attachment Method | Type | Width | Material Finish | Material | Length |
|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | BGA | 8 °C/W | 0.6 in | Pin Fins Square | Adhesive (Included) Thermal Tape | Top Mount | 0.984 in | Black Anodized | Aluminum | 0.984 in |
Wakefield Thermal Solutions | BGA | 8 °C/W | 0.6 in | Pin Fins Square | Adhesive (Not Included) Thermal Tape | Top Mount | 0.984 in | Black Anodized | Aluminum | 0.984 in |
Wakefield Thermal Solutions | BGA | 8 °C/W | 0.6 in | Pin Fins Square | Adhesive (Included) Thermal Tape | Top Mount | 0.984 in | Black Anodized | Aluminum | 0.984 in |
Wakefield Thermal Solutions | BGA | 8 °C/W | 0.6 in | Pin Fins Square | Adhesive (Included) Thermal Tape | Top Mount | 0.984 in | Black Anodized | Aluminum | 0.984 in |