CONN SOCKET PGA ZIF GOLD
| Part | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Termination | Contact Material - Mating | Features | Contact Finish - Post | Mounting Type | Current Rating (Amps) | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 30 Áin | 0.76 Ám | PGA ZIF (ZIP) | 125 °C | -65 ░C | 3.18 mm | 0.125 in | Solder | Beryllium Copper | Closed Frame | Tin | Through Hole | 1 A | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | UL94 V-0 | Gold | 200 µin | 5.08 µm |
Aries Electronics | Beryllium Copper | 30 Áin | 0.76 Ám | PGA ZIF (ZIP) | 125 °C | -65 ░C | 3.18 mm | 0.125 in | Solder | Beryllium Copper | Closed Frame | Tin | Through Hole | 1 A | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | UL94 V-0 | Gold | 200 µin | 5.08 µm |