SDL-131 Series

Catalog

CONN RCPT 62POS 0.1 GOLD PCB

Part	Pitch - Mating	Pitch - Mating	Fastening Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Rows	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Insulation Height [z]	Insulation Height [z]	Contact Finish - Post	Contact Length - Post [x]	Contact Length - Post [x]	Contact Type	Contact Material	Mounting Type	Contact Finish - Mating	Connector Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Shape	Insulation Material	Insulation Color	Number of Positions	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Length - Post	Contact Length - Post	Insulation Height	Insulation Height
Samtec Inc. SDL-131-G-12	0.1 in	2.54 mm	Push-Pull	30 Áin	0.76 Ám	2	All	10 çin	0.25 çm	0.095 in	2.41 mm	Gold	2.41 mm	0.095 in	Female Socket	Beryllium Copper	Through Hole	Gold	Receptacle	2.54 mm	0.1 in	Circular	Liquid Crystal Polymer (LCP)	Black	62	-55 °C	125 °C	Solder
Samtec Inc. SDL-131-T-11	0.1 in	2.54 mm	Push-Pull	30 Áin	0.76 Ám	2	All								Female Socket	Beryllium Copper	Through Hole	Gold	Receptacle	2.54 mm	0.1 in	Circular	Liquid Crystal Polymer (LCP)	Black	62	-55 °C	125 °C	Solder	0.108 in	2.75 mm	0.132 in	3.35 mm
Samtec Inc. SDL-131-TT-11	0.1 in	2.54 mm	Push-Pull			2	All					Tin			Female Socket	Beryllium Copper	Through Hole		Receptacle	2.54 mm	0.1 in	Circular	Liquid Crystal Polymer (LCP)	Black	62	-55 °C	105 ░C	Solder	0.108 in	2.75 mm	0.132 in	3.35 mm
Samtec Inc. SDL-131-T-12	0.1 in	2.54 mm	Push-Pull	30 Áin	0.76 Ám	2	All			0.095 in	2.41 mm		2.41 mm	0.095 in	Female Socket	Beryllium Copper	Through Hole	Gold	Receptacle	2.54 mm	0.1 in	Circular	Liquid Crystal Polymer (LCP)	Black	62	-55 °C	125 °C	Solder