100-PLS Series

Catalog

CONN SOCKET PGA ZIF GOLD

Part	Features	Current Rating (Amps)	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Termination	Pitch - Mating	Pitch - Mating	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Material - Mating	Material Flammability Rating	Contact Finish - Mating	Contact Finish - Post	Termination Post Length	Termination Post Length	Operating Temperature [Max]	Operating Temperature [Min]
Aries Electronics 100-PLS10001-12	Closed Frame	1 A	Beryllium Copper	200 µin	5.08 µm	Through Hole	Solder	0.1 in	2.54 mm	PGA ZIF (ZIP)	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	UL94 V-0	Gold	Tin	3.18 mm	0.125 in	125 °C	-65 ░C
Aries Electronics 100-PLS17048-12	Closed Frame	1 A	Beryllium Copper	200 µin	5.08 µm	Through Hole	Solder	0.1 in	2.54 mm	PGA ZIF (ZIP)	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	UL94 V-0	Gold	Tin	3.18 mm	0.125 in	125 °C	-65 ░C
Aries Electronics 100-PLS17049-12	Closed Frame	1 A	Beryllium Copper	200 µin	5.08 µm	Through Hole	Solder	0.1 in	2.54 mm	PGA ZIF (ZIP)	30 Áin	0.76 Ám	2.54 mm	0.1 in	Beryllium Copper	UL94 V-0	Gold	Tin	3.18 mm	0.125 in	125 °C	-65 ░C