1PMT5955 Series

Zener Diode Single 2-Pin(1+Tab) 180V, 20% Tolerance , 900Ohm, 3000mW Power Mite T/R

Catalog

Zener Diode Single 2-Pin(1+Tab) 180V, 20% Tolerance , 900Ohm, 3000mW Power Mite T/R

Part	Tolerance	Impedance (Max) (Zzt)	Package Name	Current - Reverse Leakage	Mounting Type	Power - Max	Voltage - Forward (Vf) (Max)	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Zener (Nom) (Vz)	Package / Case
Microchip Technology 1PMT5955CE3/TR7	2 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955E3/TR13	20 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955/TR7	20 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955BE3/TR13	5 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955E3/TR7	20 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955C/TR13	2 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955A/TR7	10 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955BE3/TR7	5 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955CE3/TR13	2 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA
Microchip Technology 1PMT5955B/TR7	5 %	800 Ohms	DO-216AA	1 µA	Surface Mount	3 VA	1.2 V	150 °C	-55 °C	180 V	DO-216AA

Catalog

Zener Diode Single 2-Pin(1+Tab) 180V, 20% Tolerance , 900Ohm, 3000mW Power Mite T/R

Description

This surface mountable 3.0 W Zener diode series in the JEDEC DO-216 package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for 3.3 to 200 V- It is an ideal selection for applications requiring low profile and high-density mounting that are also RoHS Compliant - When properly heat sunk, these Zener diodes provide power-handling capabilities only found in larger packages - In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink - Its innovative design makes this device ideal for use with automatic insertion equipment.