32-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Material Flammability Rating	Current Rating	Termination Post Length	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Housing Material	Termination	Mounting Type	Row Spacing	Type	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Pitch - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Material - Post	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 32-3551-16	UL94 V-0	1 A	0.11 in	Beryllium Copper	0.1 in	Nickel Boron	Glass Filled Polyphenylene Sulfide PPS	Solder	Through Hole	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	16	32	2	0.1 in	Closed Frame	50 µin	50 µin	Beryllium Copper	Boron Nickel
Aries Electronics 32-3551-10	UL94 V-0	1 A	0.11 in	Beryllium Copper	0.1 in	Tin	Glass Filled Polyphenylene Sulfide PPS	Solder	Through Hole	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	16	32	2	0.1 in	Closed Frame	200 Ąin	200 µin	Beryllium Copper	Tin
Aries Electronics 32-3551-11	UL94 V-0	1 A	0.11 in	Beryllium Copper	0.1 in	Gold	Glass Filled Polyphenylene Sulfide PPS	Solder	Through Hole	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	16	32	2	0.1 in	Closed Frame			Beryllium Copper	Gold
Aries Electronics 32-3551-18	UL94 V-0	1 A	0.11 in	Beryllium Nickel	0.1 in	Nickel Boron	Glass Filled PEEK Polyetheretherketone	Solder	Through Hole	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	16	32	2	0.1 in	Closed Frame	50 µin	50 µin	Beryllium Nickel	Boron Nickel	250 °C	-55 °C