CONN IC DIP SOCKET 32POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Finish - Post | Features | Contact Material - Mating | Termination Post Length | Termination Post Length | Termination | Material Flammability Rating | Current Rating (Amps) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Housing Material | Mounting Type | Pitch - Mating | Pitch - Mating | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | 10 çin | 0.25 çm | Gold | Gold | Closed Frame Elevated | Beryllium Copper | 3.56 mm | 0.14 in | Solder | UL94 V-0 | 3 A | 2 x 16 | 32 | 105 ░C | -55 °C | Glass Filled Nylon 4/6 Polyamide (PA46) | Through Hole | 0.1 in | 2.54 mm | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | Brass |