518-77 Series
Manufacturer: Preci-Dip
CONN SOCKET PGA 400POS GOLD
| Part | Grid Columns | Grid Rows | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post (string_set) | Mounting Type | Type | Housing Material | Features | Contact Material - Post | Contact Material - Mating | Termination | Pitch - Post | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Current Rating | Contact Resistance | Material Flammability Rating | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Preci-Dip | 20 | 20 | 400 | Flash | Flash | Through Hole | PGA | FR4 Epoxy Glass | Closed Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.11 in |
Preci-Dip | 19 | 19 | 357 | Flash | Flash | Through Hole | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.11 in |
Preci-Dip | 20 | 20 | 400 | Flash | Flash | Surface Mount | PGA | FR4 Epoxy Glass | Closed Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.062 in |
Preci-Dip | 31 | 31 | 520 | Flash | Flash | Through Hole | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.11 in |
Preci-Dip | 35 | 35 | 652 | Flash | Flash | Surface Mount | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.062 in |
Preci-Dip | 16 | 16 | 255 | Flash | Flash | Surface Mount | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.062 in |
Preci-Dip | 29 | 29 | 480 | Flash | Flash | Through Hole | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.11 in |
Preci-Dip | 33 | 33 | 560 | Flash | Flash | Surface Mount | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.062 in |
Preci-Dip | 26 | 26 | 456 | Flash | Flash | Through Hole | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.11 in |
Preci-Dip | 26 | 26 | 356 count | Flash | Flash | Through Hole | PGA | FR4 Epoxy Glass | Open Frame | Brass | Beryllium Copper | Solder | 0.05 in | 125 °C | -55 °C | Gold | Gold | Flash | 0.05 in | 1 A | 10 mOhm | UL94 V-0 | 0.11 in |