TMM-128 Series
Manufacturer: Samtec Inc.
2MM TERMINAL STRIP
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Pitch - Mating | Contact Finish - Mating | Connector Type | Contact Material | Termination | Fastening Type | Contact Finish Thickness - Mating | Contact Length - Post | Number of Positions Loaded | Insulation Height | Contact Shape | Contact Type | Insulation Material | Contact Finish - Post | Number of Positions | Insulation Color | Mounting Type | Shrouding | Style | Contact Length - Mating | Number of Rows | Current Rating (Per Contact) | Contact Finish Thickness - Post | Row Spacing - Mating | Material Flammability Rating | Features | Number of Positions Loaded | Overall Contact Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 125 °C | -55 °C | 0.079 in | Gold | Header | Phosphor Bronze | Solder | Push-Pull | 3 µin | 0.12 in | All | 0.079 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 28 | Black | Right Angle Through Hole | Unshrouded | Board Board or Cable | 0.126 in | 1 | 3.2 A | ||||||
Samtec Inc. | 125 °C | -55 °C | 0.079 in | Gold | Header | Phosphor Bronze | Solder | Push-Pull | 20 Ąin | 0.12 in | All | 0.079 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Gold | 28 | Black | Right Angle Through Hole | Unshrouded | Board Board or Cable | 0.126 in | 1 | 3.2 A | 3 µin | |||||
Samtec Inc. | 105 °C | -55 °C | 0.079 in | Tin | Header | Phosphor Bronze | Solder | Push-Pull | All | 0.059 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 56 | Black | Surface Mount | Unshrouded | Board Board or Cable | 0.126 in | 2 | 3.2 A | 0.079 in | UL94 V-0 | ||||||
Samtec Inc. | 125 °C | -55 °C | 0.079 in | Gold | Header | Phosphor Bronze | Solder | Push-Pull | 10 µin | All | 0.059 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 56 | Black | Surface Mount | Unshrouded | Board Board or Cable | 0.126 in | 2 | 3.2 A | 0.079 in | UL94 V-0 | Board Guide Pick and Place | ||||
Samtec Inc. | 125 °C | -55 °C | 0.079 in | Gold | Header | Phosphor Bronze | Solder | Push-Pull | 3 µin | 0.12 in | 0.155 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 56 | Black | Right Angle Through Hole | Unshrouded | Board Board or Cable | 0.126 in | 2 | 3.2 A | 0.079 in | 55 | |||||
Samtec Inc. | 125 °C | -55 °C | 0.079 in | Gold | Header | Phosphor Bronze | Solder | Push-Pull | 10 µin | 0.138 in | All | 0.059 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 56 | Black | Through Hole | Unshrouded | Board Board or Cable | 0.126 in | 2 | 3.2 A | 0.079 in | 0.323 in | ||||
Samtec Inc. | 125 °C | -55 °C | 0.079 in | Gold | Header | Phosphor Bronze | Solder | Push-Pull | 3 µin | 0.192 in | All | 0.059 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 56 | Black | Through Hole | Unshrouded | Board Board or Cable | 0.126 in | 2 | 3.2 A | 0.079 in | 0.377 in | ||||
Samtec Inc. | 105 °C | -55 °C | 0.079 in | Tin | Header | Phosphor Bronze | Solder | Push-Pull | All | 0.059 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 28 | Black | Surface Mount | Unshrouded | Board Board or Cable | 0.126 in | 1 | 3.2 A | UL94 V-0 | |||||||
Samtec Inc. | 105 °C | -55 °C | 0.079 in | Tin | Header | Phosphor Bronze | Solder | Push-Pull | 0.09 in | All | 0.059 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 56 | Black | Through Hole | Unshrouded | Board Board or Cable | 0.075 in | 2 | 3.2 A | 0.079 in | 0.224 in | |||||
Samtec Inc. | 105 °C | -55 °C | 0.079 in | Tin | Header | Phosphor Bronze | Solder | Push-Pull | 0.138 in | All | 0.059 in | Square | Male Pin | Liquid Crystal Polymer (LCP) | Tin | 28 | Black | Through Hole | Unshrouded | Board Board or Cable | 0.126 in | 1 | 3.2 A | 0.323 in |