CONN IC DIP SOCKET 30POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Housing Material | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Material - Post | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Type | Type | Type | Features | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | Wire Wrap | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | 0.5 in | 12.7 mm | Gold | 2.54 mm | 0.1 in | Phosphor Bronze | Beryllium Copper | 0.1 in | 2.54 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | Closed Frame | 30 | 2 | 15 | -55 °C | 125 °C | 3 A | 10 çin | 0.25 çm | Through Hole |
Aries Electronics | 10 çin | 0.25 çm | Wire Wrap | Glass Filled Nylon 4/6 Polyamide (PA46) | Tin | 0.5 in | 12.7 mm | Gold | 2.54 mm | 0.1 in | Phosphor Bronze | Beryllium Copper | 0.1 in | 2.54 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | Closed Frame | 30 | 2 | 15 | -55 °C | 105 ░C | 3 A | 200 µin | 5.08 µm | Through Hole |