70-3205 Series
Manufacturer: Kester Solder
Beta
⌘K
SOLDER PASTE NXG1 NO CLEAN 500GM
| Part | Shipping Info | Sn Composition | Composition Formula | Composition Elements | Cu Composition | Shelf Life Start | Form Weight | Form | Shelf Life | Type | Process | Melting Point | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Melting Point (Max) | Melting Point (Min) | Ag Composition | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 99.3 % | Sn99.3Cu0.7 | Cu Sn | 0.7 % | Date of Manufacture | 17.64 oz | Jar | 8 Months | Solder Paste | Lead Free | 441 °F | 50 °F | 32 °F | ||||
Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 96.5 % | Sn96.5Ag3Cu0.5 | Ag Cu Sn | 0.5 % | Date of Manufacture | 24.69 oz | Cartridge | 8 Months | Solder Paste | Lead Free | 50 °F | 32 °F | 424 °F | 423 °F | 3 % | 3 |