15-0022 Series
Manufacturer: McGill Microwave Systems
D-SUB HIGH DENSITY CONNECTORS D-SUB HD26P MALE R/A
| Part | Ingress Protection Description | Ingress Protection IP Rating | Number of Rows | Mounting Type | Finish | Shell Material | Backset Spacing | Material Flammability Rating | Current Rating | Connector Style | Contact Finish | Termination | Flange Feature | Number of Positions | Contact Type | Features | Connector Type | Shell Size | Connector Layout | Contact Finish Thickness | Color | Voltage Rating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Material | Dielectric Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
McGill Microwave Systems | Dust Tight Waterproof | IP67 | 3 | Board Edge Right Angle Through Hole | Nickel Plated | Zinc Die Cast | 0.22 in | UL94 V-0 | 3 A | D-Sub High Density | Gold | Solder | Female Screwlock (4-40) Mating Side | 26 | Signal | Board Lock Mounting Brackets | Male Pins Plug | 2 | A DA High Density | 8 µin | Black | 60 V | 105 °C | -25 °C | Copper Alloy | Glass Filled Polybutylene Terephthalate (PBT) |
McGill Microwave Systems | Dust Tight Waterproof | IP67 | 3 | Board Edge Right Angle Through Hole | Nickel Plated | Zinc Die Cast | 0.22 in | UL94 V-0 | 3 A | D-Sub High Density | Gold | Solder | Female Screwlock (4-40) Mating Side | 44 | Signal | Board Lock Mounting Brackets | Female Sockets Receptacle | 3 | B DB High Density | 8 µin | Black | 60 V | 105 °C | -25 °C | Copper Alloy | Glass Filled Polybutylene Terephthalate (PBT) |
McGill Microwave Systems | Dust Tight Waterproof | IP67 | 3 | Board Edge Right Angle Through Hole | Nickel Plated | Zinc Die Cast | 0.22 in | UL94 V-0 | 3 A | D-Sub High Density | Gold | Solder | Female Screwlock (4-40) Mating Side | 62 | Signal | Board Lock Mounting Brackets | Male Pins Plug | 4 | C DC High Density | 8 µin | Black | 60 V | 105 °C | -25 °C | Copper Alloy | Glass Filled Polybutylene Terephthalate (PBT) |
McGill Microwave Systems | Dust Tight Waterproof | IP67 | 3 | Board Edge Right Angle Through Hole | Nickel Plated | Zinc Die Cast | 0.22 in | UL94 V-0 | 3 A | D-Sub High Density | Gold | Solder | Female Screwlock (4-40) Mating Side | 26 | Signal | Board Lock Mounting Brackets | Female Sockets Receptacle | 2 | A DA High Density | 8 µin | Black | 60 V | 105 °C | -25 °C | Copper Alloy | Glass Filled Polybutylene Terephthalate (PBT) |
McGill Microwave Systems | Dust Tight Waterproof | IP67 | 3 | Board Edge Right Angle Through Hole | Nickel Plated | Zinc Die Cast | 0.22 in | UL94 V-0 | 3 A | D-Sub High Density | Gold | Solder | Female Screwlock (4-40) Mating Side | 15 | Signal | Board Lock Mounting Brackets | Female Sockets Receptacle | 1 | DE E High Density | 8 µin | Black | 60 V | 105 °C | -25 °C | Copper Alloy | Glass Filled Polybutylene Terephthalate (PBT) |
McGill Microwave Systems | Dust Tight Waterproof | IP67 | 3 | Board Edge Right Angle Through Hole | Nickel Plated | Zinc Die Cast | 0.22 in | UL94 V-0 | 3 A | D-Sub High Density | Gold | Solder | Female Screwlock (4-40) Mating Side | 44 | Signal | Board Lock Mounting Brackets | Male Pins Plug | 3 | B DB High Density | 8 µin | Black | 60 V | 105 °C | -25 °C | Copper Alloy | Glass Filled Polybutylene Terephthalate (PBT) |