HTSS-113 Series

Catalog

CONN HEADER VERT 26POS 2.54MM

Part	Shrouding	Pitch - Mating	Overall Contact Length	Contact Finish - Mating	Features	Fastening Type	Termination	Number of Positions	Contact Finish Thickness - Mating	Insulation Material	Mounting Type	Style	Contact Length - Mating	Number of Rows	Contact Shape	Contact Type	Material Flammability Rating	Contact Length - Post	Insulation Height	Contact Finish - Post	Number of Positions Loaded	Insulation Color	Connector Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material	Row Spacing - Mating	Contact Finish Thickness - Post
Samtec Inc. HTSS-113-02-L-D	Shrouded - 4 Wall	0.1 in	0.53 in	Gold	Keying Slot	Push-Pull	Solder	26	10 µin	Liquid Crystal Polymer (LCP)	Through Hole	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0	0.165 in	0.35 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-01-S-DV	Shrouded - 4 Wall	0.1 in		Gold	Keying Slot	Push-Pull	Solder	26	30 µin	Liquid Crystal Polymer (LCP)	Surface Mount	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0		0.35 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-01-LM-DV	Shrouded - 4 Wall	0.1 in		Gold	Keying Slot	Push-Pull	Solder	26	10 µin	Liquid Crystal Polymer (LCP)	Surface Mount	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0		0.35 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-01-L-DV-P-TR	Shrouded - 4 Wall	0.1 in		Gold	Keying Slot Pick and Place	Push-Pull	Solder	26	10 µin	Liquid Crystal Polymer (LCP)	Surface Mount	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0		0.35 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-04-L-D-RA	Shrouded - 4 Wall	0.1 in		Gold	Keying Slot	Push-Pull	Solder	26	10 µin	Liquid Crystal Polymer (LCP)	Right Angle Through Hole	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0	0.13 in	0.365 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-01-F-D	Shrouded - 4 Wall	0.1 in	0.48 in	Gold	Keying Slot	Push-Pull	Solder	26	3 µin	Liquid Crystal Polymer (LCP)	Through Hole	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0	0.115 in	0.35 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-01-L-D	Shrouded - 4 Wall	0.1 in	0.48 in	Gold	Keying Slot	Push-Pull	Solder	26	10 µin	Liquid Crystal Polymer (LCP)	Through Hole	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0	0.115 in	0.35 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-05-S-D-RA	Shrouded - 4 Wall	0.1 in		Gold	Keying Slot	Push-Pull	Solder	26	30 µin	Liquid Crystal Polymer (LCP)	Right Angle Through Hole	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0	0.23 in	0.365 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-01-L-DV	Shrouded - 4 Wall	0.1 in		Gold	Keying Slot	Push-Pull	Solder	26	10 µin	Liquid Crystal Polymer (LCP)	Surface Mount	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0		0.35 in	Tin	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in
Samtec Inc. HTSS-113-01-H-D	Shrouded - 4 Wall	0.1 in	0.48 in	Gold	Keying Slot	Push-Pull	Solder	26	30 µin	Liquid Crystal Polymer (LCP)	Through Hole	Board Board or Cable	0.25 in	2	Square	Male Pin	UL94 V-0	0.115 in	0.35 in	Gold	All	Natural	Header	125 °C	-55 °C	Phosphor Bronze	0.1 in	3 µin