TS391S Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
THERMALLY STABLE SOLDER PASTE NO
| Part | Ag Composition | Composition Elements | Composition Formula | Cu Composition | Sn Composition | Process | Storage/Refrigeration Temperature (Minimum) | Storage/Refrigeration Temperature (Maximum) | Form Volume | Form | Form Weight | Shelf Life | Melting Point (Max) | Melting Point (Min) | Mesh Type | Shelf Life Start | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Lead Free | 68 °F | 77 °F | 10 cc | Syringe | 1.23 oz | 12 Months | 428 °F | 423 °F | 4 | Date of Manufacture | Solder Paste |