CONN RCPT 21POS 0.079 GOLD SMD
| Part | Contact Finish - Mating | Features | Number of Rows | Connector Type | Contact Type | Contact Material | Fastening Type | Insulation Height | Insulation Height | Current Rating (Amps) | Number of Positions | Number of Positions Loaded | Insulation Material | Operating Temperature [Min] | Operating Temperature [Max] | Style | Material Flammability Rating | Pitch - Mating [x] | Pitch - Mating [x] | Termination | Mounting Type | Insulation Color | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Shape | Voltage Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Row Spacing - Mating | Row Spacing - Mating | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Pick and Place | 1 | Receptacle | Female Socket | Beryllium Copper | Push-Pull | 3.56 mm | 0.14 in | 3.2 A | 21 | All | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Board to Board Cable | UL94 V-0 | 0.079 in | 2 mm | Solder | Surface Mount | Black | Tin | 30 Áin | 0.76 Ám | Square | 350 VAC | |||||
Samtec Inc. | Gold | 2 | Receptacle | Female Socket | Beryllium Copper | Push-Pull | 3.56 mm | 0.14 in | 3.2 A | 42 | All | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Board to Board Cable | UL94 V-0 | 0.079 in | 2 mm | Solder | Surface Mount | Black | Gold | 30 Áin | 0.76 Ám | Square | 350 VAC | 3 µin | 0.076 µm | 0.079 in | 2 mm | ||
Samtec Inc. | Gold | 2 | Receptacle | Female Socket | Beryllium Copper | Push-Pull | 3.56 mm | 0.14 in | 3.2 A | 42 | All | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Board to Board Cable | UL94 V-0 | 0.079 in | 2 mm | Solder | Surface Mount | Black | Tin | 30 Áin | 0.76 Ám | Square | 350 VAC | 0.079 in | 2 mm | ||||
Samtec Inc. | Gold | 1 | Receptacle | Female Socket | Beryllium Copper | Push-Pull | 3.56 mm | 0.14 in | 3.2 A | 21 | All | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Board to Board Cable | UL94 V-0 | 0.079 in | 2 mm | Solder | Surface Mount | Black | Tin | 30 Áin | 0.76 Ám | Square | 350 VAC | ||||||
Samtec Inc. | Gold | 2 | Receptacle | Female Socket | Beryllium Copper | Push-Pull | 3.56 mm | 0.14 in | 3.2 A | 42 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Board to Board Cable | UL94 V-0 | 0.079 in | 2 mm | Solder | Surface Mount | Black | Tin | 30 Áin | 0.76 Ám | Square | 350 VAC | 0.079 in | 2 mm | 41 | ||||
Samtec Inc. | Gold | Pick and Place | 1 | Receptacle | Female Socket | Beryllium Copper | Push-Pull | 3.56 mm | 0.14 in | 3.2 A | 21 | All | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Board to Board Cable | UL94 V-0 | 0.079 in | 2 mm | Solder | Surface Mount | Black | Tin | 30 Áin | 0.76 Ám | Square | 350 VAC | |||||
Samtec Inc. | Gold | Pick and Place | 2 | Receptacle | Female Socket | Beryllium Copper | Push-Pull | 3.56 mm | 0.14 in | 3.2 A | 42 | All | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Board to Board Cable | UL94 V-0 | 0.079 in | 2 mm | Solder | Surface Mount | Black | Tin | 30 Áin | 0.76 Ám | Square | 350 VAC | 0.079 in | 2 mm |