ESQ-117 Series
Manufacturer: Samtec Inc.
CONN SOCKET 51POS 0.1 GOLD PCB
| Part | Contact Finish - Post | Contact Finish - Mating | Contact Length - Post | Termination | Insulation Height | Contact Finish Thickness - Mating | Connector Type | Material Flammability Rating | Operating Temperature (Max) | Operating Temperature (Min) | Number of Rows | Current Rating (Per Contact) | Pitch - Mating | Fastening Type | Insulation Color | Voltage Rating | Style | Contact Type | Mounting Type | Row Spacing - Mating | Number of Positions | Number of Positions Loaded | Insulation Material | Contact Shape | Contact Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Tin | Gold | 0.28 in | Solder | 0.635 in | 10 µin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 3 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 0.1 in | 51 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | Tin | Gold | 0.19 in | Solder | 0.535 in | 10 µin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 2 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 0.1 in | 34 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | Tin | Tin | 0.48 in | Solder | 0.435 in | Elevated Socket | UL94 V-0 | 105 °C | -55 °C | 1 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 17 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |||
Samtec Inc. | Gold | Gold | 0.19 in | Solder | 0.535 in | 20 Ąin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 1 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 17 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin | |
Samtec Inc. | Tin | Gold | 0.29 in | Solder | 0.435 in | 10 µin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 2 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 0.1 in | 34 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | Gold | Gold | 0.19 in | Solder | 0.535 in | 20 Ąin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 2 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 0.1 in | 34 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin |
Samtec Inc. | Tin | Gold | 0.29 in | Solder | 0.435 in | 10 µin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 2 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 0.1 in | 34 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | Tin | Tin | 0.09 in | Solder | 0.435 in | Elevated Socket | UL94 V-0 | 105 °C | -55 °C | 1 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 17 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |||
Samtec Inc. | Tin | Gold | 0.09 in | Solder | 0.435 in | 10 µin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 2 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 0.1 in | 34 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | Gold | Gold | 0.28 in | Solder | 0.635 in | 20 Ąin | Elevated Socket | UL94 V-0 | 125 °C | -55 °C | 2 | 5.7 A | 0.1 in | Push-Pull | Black | 550 V | Board | Forked | Through Hole | 0.1 in | 34 | All | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin |