24-1518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Pitch - Post	Pitch - Post	Housing Material	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Material - Mating	Material Flammability Rating	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Contact Finish - Post	Features	Contact Finish - Mating	Termination Post Length	Termination Post Length	Termination
Aries Electronics 24-1518-10	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	UL94 V-0	DIP	5.08 mm	0.2 in	10 çin	0.25 çm	Brass	24	Tin	Open Frame	Gold	3.18 mm	0.125 in	Solder
Aries Electronics 24-1518-00	200 µin	5.08 µm	3 A	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Surface Mount	Beryllium Copper	UL94 V-0	DIP	5.08 mm	0.2 in	10 çin	0.25 çm	Brass	24	Tin	Open Frame	Gold	3.18 mm	0.125 in	Solder
Aries Electronics 24-1518-11H	10 çin	0.25 çm	3 A	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	UL94 V-0	DIP	5.08 mm	0.2 in	10 çin	0.25 çm	Brass	24	Gold	Open Frame	Gold	3.18 mm	0.125 in	Solder
Aries Electronics 24-1518-11	10 çin	0.25 çm	3 A	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Beryllium Copper	UL94 V-0	DIP	5.08 mm	0.2 in	10 çin	0.25 çm	Brass	24	Gold	Open Frame	Gold	3.18 mm	0.125 in	Solder