24-1518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish - Post	Row Spacing	Type	Contact Material - Post	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Pitch - Mating	Termination	Mounting Type	Features	Contact Material - Mating	Contact Finish Thickness - Mating	Pitch - Post
Aries Electronics 24-1518-10	0.125 in	UL94 V-0	3 A	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	Tin	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	2	24	12	0.1 in	Solder	Through Hole	Open Frame	Beryllium Copper	10 µin	0.1 in
Aries Electronics 24-1518-00	0.125 in	UL94 V-0	3 A	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	Tin	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	2	24	12	0.1 in	Solder	Surface Mount	Open Frame	Beryllium Copper	10 µin	0.1 in
Aries Electronics 24-1518-11H	0.125 in	UL94 V-0	3 A	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	2	24	12	0.1 in	Solder	Through Hole	Open Frame	Beryllium Copper	10 µin	0.1 in
Aries Electronics 24-1518-11	0.125 in	UL94 V-0	3 A	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Gold	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	2	24	12	0.1 in	Solder	Through Hole	Open Frame	Beryllium Copper	10 µin	0.1 in
Aries Electronics 24-1518-10T	0.125 in	UL94 V-0	3 A	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	Tin	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	2	24	12	0.1 in	Solder	Through Hole	Open Frame	Beryllium Copper	10 µin	0.1 in