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32P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Contact Finish - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Current Rating (Amps) | Pitch - Post | Pitch - Post | Type | Type | Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post [custom] | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Housing Material | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | Closed Frame | 200 µin | 5.08 µm | Tin | 3 A | 2.54 mm | 0.1 in | 0.3 " | 7.62 mm | DIP | 2 x 16 | 32 | 0.1 in | 2.54 mm | UL94 V-0 | 30 Áin | 0.76 Ám | Beryllium Copper | Brass | Solder | 105 ░C | -55 °C | Glass Filled Nylon 4/6 Polyamide (PA46) | 3.56 mm | 0.14 in |