CONN RCPT 56POS 0.05 GOLD SMD
| Part | Number of Positions | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Height | Insulation Height | Insulation Color | Features | Connector Type | Style | Material Flammability Rating | Insulation Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Type | Mounting Type | Termination | Fastening Type | Contact Finish - Post | Contact Shape | Row Spacing - Mating | Row Spacing - Mating | Contact Material | Number of Positions Loaded | Number of Rows | Contact Length - Post [x] | Contact Length - Post [x] | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 30 Áin | 0.76 Ám | 0.185 in | 4.7 mm | Black | Pick and Place | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Surface Mount | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Beryllium Copper | All | 2 | |||
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 30 Áin | 0.76 Ám | 0.18 " | 4.57 mm | Black | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Through Hole | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Beryllium Copper | All | 2 | 0.12 in | 3.05 mm | ||
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 30 Áin | 0.76 Ám | 0.18 " | 4.57 mm | Black | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Through Hole | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Phosphor Bronze | All | 2 | 0.12 in | 3.05 mm | ||
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 10 çin | 0.25 çm | 0.185 in | 4.7 mm | Black | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Surface Mount | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Beryllium Copper | All | 2 | ||||
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 30 Áin | 0.76 Ám | 0.185 in | 4.7 mm | Black | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Surface Mount | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Beryllium Copper | All | 2 | ||||
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 30 Áin | 0.76 Ám | 0.18 " | 4.57 mm | Black | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Through Hole | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Beryllium Copper | All | 2 | 0.12 in | 3.05 mm | ||
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 10 çin | 0.25 çm | 0.18 " | 4.57 mm | Black | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Through Hole | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Beryllium Copper | All | 2 | 0.075 in | 1.91 mm | ||
Samtec Inc. | 56 | Gold | 0.05 in | 1.27 mm | 2.9 A | 10 çin | 0.25 çm | 0.185 in | 4.7 mm | Black | Receptacle | Board to Board Cable | UL94 V-0 | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Female Socket | Surface Mount | Solder | Push-Pull | Tin | Square | 0.05 in | 1.27 mm | Phosphor Bronze | All | 2 |