CONN SOCKET SIP 19POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Mounting Type | Termination | Contact Material - Mating | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Current Rating (Amps) | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Housing Material | Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Brass | Through Hole | Solder | Beryllium Copper | UL94 V-0 | 200 µin | 5.08 µm | Tin | 3 A | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Gold | Glass Filled Nylon 4/6 Polyamide (PA46) | SIP | 1 x 19 | 19 |
Aries Electronics | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Brass | Through Hole | Solder | Beryllium Copper | UL94 V-0 | 10 çin | 0.25 çm | Gold | 3 A | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Gold | Glass Filled Nylon 4/6 Polyamide (PA46) | SIP | 1 x 19 | 19 |
Aries Electronics | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Brass | Through Hole | Solder | Beryllium Copper | UL94 V-0 | 200 µin | 5.08 µm | Tin | 3 A | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Gold | Glass Filled Nylon 4/6 Polyamide (PA46) | SIP | 1 x 19 | 19 |
Aries Electronics | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Brass | Through Hole | Solder | Beryllium Copper | UL94 V-0 | 10 çin | 0.25 çm | Gold | 3 A | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Gold | Glass Filled Nylon 4/6 Polyamide (PA46) | SIP | 1 x 19 | 19 |